As a first step, after the order has been received, the work will be planed and the components purchased. There are instructions for each project, therefore, the (process) information required for the work is clearly recorded. Any desired additional audits are planned in cooperation with the Purchasing Department. Changes to the PCB (Printed Circuit Board) and BOM (parts list) are only made after consultation with and the approval of the client. At the SMD and Through-hole departments, the (electronic) components will be placed and soldered to the PCBs.
The solder paste is applied to the bare board by the DEK Horizon 02 screen printers. Our modern Samsung SM411, SM421, SM482 and SM471Plus SMD placement machines automatically place the components on the board. The Soltec My- Reflow ovens, which have 8 heating and 2 cooling zones, does the soldering. The Viscom (3088 AV AOI) automatically performs an optical inspection and the board is also inspected visually. We are also able to use the Dage X-ray Inspection System (XD7500VR) to inspect specific soldered joints.
The board is inspected after the SMD components have been placed and soldered to the board. There are three possibilities:
After completion of the SMD production phase, the Conventional Department can perform the following activities:
It is also possible to perform activities related to final assembly / systems / mechatronics such as climatic testing, burn-in, cleaning, coating and potting of PCBs or mounting in an appropriate enclosure.
After the conventional components have been placed manually on the board, they are soldered in place by the wave soldering machine.
In addition to manual soldering we can also use a Soltec mySelective 6745 soldering machine. This machine is mainly used for soldering (large) connectors and in situations where the SMD and conventional components are not located on the same side of the board. The soldering process takes place in a nitrogen-rich (N2) atmosphere. A loader and an unloader ensure the efficient flow of PCBs. Speed, accuracy and consistent quality are the key words that describe this new soldering process. It is important that the design ensures that there is 5 mm free space around the area to be selectively soldered, otherwise a (SMD) component that is too close will be destroyed or the area cannot be soldered.
Head Electronics BV
2222 AH Katwijk
Tel: +31 (0)71 - 4029 154
Chamber of Commerce Utrecht nr.: